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 HY57V651620B
4 Banks x 1M x 16Bit Synchronous DRAM
DESCRIPTION
The Hynix HY57V641620HG is a 67,108,864-bit CMOS Synchronous DRAM, ideally suited for the main memory applications which require large memory density and high bandwidth. HY57V641620HG is organized as 4banks of 1,048,576x16. H Y 5 7 V 6 4 1 6 2 0 H G i s o f f e r i n g f u l l y s y n c h r o n o u s o p e r a t i o n r e f e r e n c e d t o a p o s i t i v e e d g e o f t h e c l o c k . A l l i n p u t s a n d o u t p u t s a r e s y nc h r o nized with the rising edge of the clock input. The data paths are internally pipelined to achieve very high bandwidth. All input and output voltage levels are compatible with LVTTL. P r o g r a m m a b l e o p t i o n s i n c l u d e t h e l e n g t h o f p i p e l i n e ( R e a d l a t e n c y o f 2 o r 3 ) , t h e n u m b e r o f c o n s e c u t i v e r e a d o r w r i t e c y c l e s i n it i a t e d by a single control command (Burst length of 1,2,4,8 or Full page), and the burst count sequence(sequential or interleave). A burst of r e a d o r w r i t e c y c l e s i n p r o g r e s s c a n b e t e r m i n a t e d b y a b u r s t t e r m i n a t e c o m m a n d o r c a n b e i n t e r r u p t e d a n d r e p l a c e d b y a n e w b u r st read or write command on any cycle. (This pipelined design is not restricted by a 2N rule.)
FEATURES
* * * Single 3.30.3V power supply
Note)
* * *
Auto refresh and self refresh 4096 refresh cycles / 64ms Programmable Burst Length and Burst Type - 1, 2, 4, 8 or Full page for Sequential Burst
All device pins are compatible with LVTTL interface JEDEC standard 400mil 54pin TSOP-II with 0.8mm of pin pitch
*
All inputs and outputs referenced to positive edge of system clock - 1, 2, 4 or 8 for Interleave Burst * Programmable CAS Latency ; 2, 3 Clocks
* *
Data mask function by UDQM or LDQM Internal four banks operation
ORDERING INFORMATION
Part No.
HY57V651620BTC-55 HY57V651620BTC-6 HY57V651620BTC-7 HY57V651620BTC-75 HY57V651620BTC-8 HY57V651620BTC-10P HY57V651620BTC-10S HY57V651620BTC-10 HY57V651620BLTC-55 HY57V651620BLTC-6 HY57V651620BLTC-7 HY57V651620BLTC-75 HY57V651620BLTC-8 HY57V651620BLTC-10P HY57V651620BLTC-10S HY57V651620BLTC-10
Clock Frequency
183MHz 166MHz 143MHz 133MHz
Power
Organization
Interface
Package
Normal 125MHz 100MHz 100MHz 100MHz 183MHz 166MHz 143MHz 133MHz Low power 125MHz 100MHz 100MHz 100MHz 4Banks x 1Mbits x16 400mil 54pin TSOP II
LVTTL
Note : VDD(Min) of HY57V651620B(L)TC-55/6/7 is 3.135V
This document is a general product description and is subject to change without notice. Hyundai Electronics does not assume any responsibility for use of circuits described. No patent licenses are implied. Rev. 1.9/Apr.01
HY57V651620B
PIN CONFIGURATION
VDD DQ0 VDDQ DQ1 DQ2 VSSQ DQ3 DQ4 VDDQ DQ5 DQ6 VSSQ DQ7 VDD LDQM /WE /CAS /RAS /CS BA0 BA1 A10/AP A0 A1 A2 A3 VDD 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 54pin TSOP II 400mil x 875mil 0.8mm pin pitch 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 V SS DQ15 V SSQ DQ14 DQ13 V DDQ DQ12 DQ11 V SSQ DQ10 DQ9 V DDQ DQ8 V SS NC UDQM CLK CKE NC A11 A9 A8 A7 A6 A5 A4 V SS
PIN DESCRIPTION
PIN PIN NAME DESCRIPTION The system clock input. All other inputs are registered to the SDRAM on the rising edge of CLK Controls internal clock signal and when deactivated, the SDRAM will be one of the states among power down, suspend or self refresh Enables or disables all inputs except CLK, CKE and DQM S e l e c t s b a n k t o b e a c t i v a t e d d u r i n g R A S activity S e l e c t s b a n k t o b e r e a d / w r i t t e n d u r i n g C A S activity Row Address : RA0 ~ RA11, Column Address : CA0 ~ CA7 Auto-precharge flag : A10
CLK
Clock
CKE
Clock Enable
CS
Chip Select
BA0,BA1
Bank Address
A0 ~ A11
Address
Row Address Strobe, R A S , C A S, W E Column Address Strobe, Write Enable LDQM, UDQM DQ0 ~ DQ15 V D D /V S S V D D Q /V S S Q NC Data Input/Output Mask Data Input/Output Power Supply/Ground Data Output Power/Ground No Connection
R A S , C A S and W E define the operation Refer function truth table for details
Controls output buffers in read mode and masks input data in write mode Multiplexed data input / output pin Power supply for internal circuits and input buffers Power supply for output buffers No connection
Rev. 1.9/Apr.01
2
HY57V651620B
FUNCTIONAL BLOCK DIAGRAM
1Mbit x 4banks x 16 I/O Synchronous DRAM
Self refresh logic & timer
Internal Row counter
CLK
Row active
1Mx16 Bank 3
Row Pre Decoders
1Mx16 Bank 2
X decoders
CKE CS
1Mx16 Bank 1
X decoders
1Mx16 Bank 0
State Machine
X decoders
RAS
DQ0 DQ1
Sense AMP & I/O Gate
X decoders
I/O Buffer & Logic
Memory Cell Array
CAS WE UDQM
refresh
Column Active
Column Pre Decoders
DQ14 DQ15
LDQM
Y decoders
Column Add
Bank Select
Counter
A0 A1
Address Registers
Address buffers
Burst Counter
A11 BA0 BA1
CAS Latency
Mode Registers
Data Out Control
Pipe Line Control
Rev. 1.9/Apr.01
3
HY57V651620B
ABSOLUTE MAXIMUM RATINGS
Parameter Ambient Temperature Storage Temperature Voltage on Any Pin relative to V S S Voltage on V D D relative to V S S Short Circuit Output Current Power Dissipation Soldering Temperature T i m e TA TS T G V IN, V O U T VDD, VD D Q IO S PD TSOLDER Symbol 0 ~ 70 -55 ~ 125 -1.0 ~ 4.6 -1.0 ~ 4.6 50 1 260 10 Rating C C V V mA W C S e c Unit
Note : Operation at above absolute maximum rating can adversely affect device reliability
DC OPERATING CONDITION
Parameter Power Supply Voltage Input High Voltage Input Low Voltage Symbol VD D , VDDQ V IH V IL
( T A = 0 t o 7 0 C )
Min 3.0 2.0 V S S Q - 2.0
Typ. 3.3 3.0 0
Max 3.6 V DDQ + 2.0 0.8
Unit V V V
Note 1,2 1,3 1,4
Note : 1.All voltages are referenced to VSS = 0 V 2.VDD(min) of HY57V651620B(L)TC-55/6/7 is 3.135V 3.V IH (max) is acceptable 5.6V AC pulse width with 3ns of duration 4.V IL (min) is acceptable -2.0V AC pulse width with 3ns of duration
AC OPERATING CONDITION
Parameter AC Input High / Low Level Voltage
( T A = 0 t o 7 0 C , V D D = 3 . 3 0 . 3 V N o t e 2 , V S S = 0 V )
Symbol V I H / V IL Vtrip tR / tF Voutref CL
Value 2.4/0.4 1.4 1 1.4 50
Unit V V ns V pF
Note
Input Timing Measurement Reference Level Voltage Input Rise / Fall Time Output Timing Measurement Reference Level Output Load Capacitance for Access Time Measurement
1
Note : 1. Output load to measure access time is equivalent to two TTL gates and one capacitor (50pF) For details, refer to AC/DC output circuit 2. VDD(min) of HY57V651620B(L)TC-55/6/7 is 3.135V
Rev. 1.9/Apr.01
4
HY57V651620B
CAPACITANCE
Parameter Input capacitance CLK A0 ~ A11, BA0, BA1, CKE, C S, RAS, CAS, W E, UDQM, LDQM Data input / output capacitance DQ0 ~ DQ15 C I/O 2 6.5 pF ( T A = 2 5C , f = 1 M H z )
Pin
Symbol C I1 CI 2
Min 2 2.5
Max 4 5
Unit pF pF
OUTPUT LOAD CIRCUIT
Vtt=1.4V
RT=250
Output
Output
50pF
50 pF
DC Output Load Circuit
AC Output Load Circuit
DC CHARACTERISTICS I
Parameter Input Leakage Current Output Leakage Current Output High Voltage Output Low Voltage IL I IL O VOH VOL
( T A = 0 t o 7 0 C , V DD =3.3 0 . 3 V Note3)
Symbol
Min. -1 -1 2.4 -
Max 1 1 0.4
Unit uA uA V V
Note 1 2 IO H = - 4 m A IO L = + 4 m A
Note : 1 . V I N = 0 t o 3 . 6 V , A l l o t h e r p i n s a r e n o t t e s t e d u n d e r V IN = 0 V 2.DO U T is disabled, V O U T =0 to 3.6 3..VDD(min) of HY57V651620B(L)TC-55/6/7 is 3.135V
Rev. 1.9/Apr.01
5
HY57V651620B
DC CHARACTERISTICS II
( T A = 0 t o 7 0 C , V D D = 3 . 3 0 . 3 V
Note5
, VSS =0V)
Speed Parameter Symbol Test Condition -55 Burst length=1, One bank active tR C tR C ( m i n ) , I O L = 0 m A C K E V IL(max), tC K = min C K E V IL(max), tC K = -6 -7 -75 -8 -10P -10S -10 Unit Note
Operating Current
ID D 1
120
110
100
90
80
70
700
80
mA
1
Precharge Standby Current in Power Down Mode
ID D 2 P ID D 2 P S
2 2
mA mA
C K E V IH ( m i n ) , C S V I H ( m i n ) , t C K = min ID D 2 N Precharge Standby Current in Non Power Down Mode Input signals are changed one time during 2clks. All other pins V DD 0.2V or 0.2V C K E V IH ( m i n ) , t C K = 15 mA
ID D 2 N S
Input signals are stable. C K E V IL(max), tC K = min C K E V IL(max), tC K =
15
mA
Active Standby Current in Power Down Mode
ID D 3 P ID D 3 P S
5 5
mA mA
C K E V IH ( m i n ) , C S V I H ( m i n ) , t C K = min ID D 3 N Active Standby Current in Non Power Down Mode Input signals are changed one time during 2clks. All other pins V DD 0.2V or 0.2V C K E V IH ( m i n ) , t C K = 30 mA
ID D 3 N S
30
mA
Input signals are stable. tC K tC K ( m i n ) , Burst Mode Operating Current ID D 4 IO L = 0 m A All banks active Auto Refresh Current ID D 5 CL=2 90 200 90 200 90 200 90 200 2 Self Refresh Current ID D 6 CKE 0.2V 500 uA 4 90 200 90 180 90 180 90 150 mA mA mA 2 3 CL=3 150 140 130 120 110 90 90 90 mA 1
tR R C tR R C ( m i n ) , A l l b a n k s a c t i v e
Note : 1.ID D 1 a n d I D D 4 depend on output loading and cycle rates. Specified values are measured with the output open 2.Min. of tRRC (Refresh R A S cycle time) is shown at AC CHARACTERISTICS II 3.HY57V651620BTC-55/6/7/75/8/10P/10S/10 4.HY57V651620BLTC-55/6/7/75/8/10P/10S/10 5..VDD(min) of HY57V651620B(L)TC-55/6/7 is 3.135V
Rev. 1.9/Apr.01
6
HY57V651620B
AC CHARACTERISTICS I
-55 Parameter Symbol Min C A S Latency = 3 C A S Latency = 2 tCK3 tCK2 tCHW tCLW tAC3 tAC2 tOH tDS tDH tAS tAH tCKS tCKH tCS tCH tOLZ tOHZ3 5.4 C A S Latency = 2 tOHZ2 5.4 5.4 3 6 3 6 3 6 3 6 3 8 ns 55 1000 10 2.75 2.75 2.5 1.5 0.8 1.5 0.8 1.5 0.8 1.5 0.8 1 5.4 6 10 2.5 2.5 2.7 1.5 0.8 1.5 0.8 1.5 0.8 1.5 0.8 1 5.4 6 Max Min 6 1000 10 2.5 2.5 2.7 1.5 0.8 1.5 0.8 1.5 0.8 1.5 0.8 1.5 5.4 6 Max Min 7 1000 10 2.5 2.5 2.7 1.5 0.8 1.5 0.8 1.5 0.8 1.5 0.8 1 2.7 5.4 6 5.4 Max Min 7.5 1000 10 3 3 3 2 1 2 1 2 1 2 1 1 3 6 6 6 Max Min 8 1000 10 3 3 3 2 1 2 1 2 1 2 1 1 3 6 6 6 Max Min 10 1000 12 3 3 3 2 1 2 1 2 1 2 1 1 3 6 6 6 Max Min 10 1000 12 3 3 3 3 1 3 1 3 1 3 1 1 3 8 8 8 Max Min 10 1000 ns ns ns ns 2 C A S Latency = 2 ns ns ns ns ns ns ns ns ns ns ns ns 1 1 1 1 1 1 1 1 1 1 Max ns -6
(AC operating conditions unless otherwise noted)
-7
-75
-8
-10P
-10S
-10 Unit Note
System clock cycle time
Clock high pulse width Clock low pulse width C A S Latency = 3
Access time from clock
Data-out hold time Data-Input setup time Data-Input hold time Address setup time Address hold time CKE setup time CKE hold time Command setup time Command hold time CLK to data output in low Z-time C A S Latency = 3
CLK to data output in high Z-time
Note : 1.Assume tR / tF (input rise and fall time ) is 1ns 2.Access times to be measured with input signals of 1v/ns edge rate
Rev. 1.9/Apr.01
7
HY57V651620B
AC CHARACTERISTICS I
-55 Parameter Symbol Min Operation R A S Cycle Time Auto Refresh Max Min 60 Max Min 70 Max Min 65 Max Min 68 Max Min 70 Max Min 70 Max Min 80 Max ns -6 -7 -75 -8 -10P -10S -10 Unit Note
tR C tR R C tR C D tR A S tR P tR R D tC C D tW T L tD P L tD A L tD Q Z tD Q M tM R D tP R O Z 3 tP R O Z 2 tP D E tS R E tR E F
55
60
-
60
-
702
-
65
-
68
-
70
-
70
-
96
-
ns
R A S to C A S Delay
16.5
-
18
-
20
-
20
-
20
-
20
-
20
-
30
-
ns
R A S Active Time
38.5
100K
42
100K
42
120K
45
100K
48
100K
50
100K
50
100K
50
100K
ns
RAS Precharge Time
16.5
-
18
-
20
-
20
-
20
-
20
-
20
-
30
-
ns
R A S to R A S Bank Active Delay
11
-
12
-
14
-
15
-
16
-
20
-
20
-
20
-
ns
C A S to C A S Delay
1
-
1
-
1
-
1
-
1
-
1
-
1
-
1
-
CLK
Write Command to Data-In Delay
0
-
0
-
0
-
0
-
0
-
0
-
0
-
0
-
CLK
Data-In to Precharge Command
2
-
2
-
1
-
2
-
2
-
1
-
1
-
1
-
CLK
Data-In to Active Command
5
-
5
-
4
-
5
-
5
-
3
-
3
-
4
-
CLK
DQM to Data-Out Hi-Z
2
-
2
-
2
-
2
-
2
-
2
-
2
-
2
-
CLK
DQM to Data-In Mask
0
-
0
-
0
-
0
-
0
-
0
-
0
-
0
-
CLK
MRS to New Command
2
-
2
-
1
-
2
-
2
-
2
-
2
-
2
-
CLK
C A S Latency = 3 Precharge to Data Output Hi-Z C A S Latency = 2
3
-
3
-
3
-
3
-
3
-
3
-
3
-
3
-
CLK
2
-
2
-
2
-
2
-
2
-
2
-
2
-
2
-
CLK
Power Down Exit Time
1
-
1
-
1
-
1
-
1
-
1
-
1
-
1
-
CLK
Self Refresh Exit Time
1
-
1
-
1
-
1
-
1
-
1
-
1
-
1
-
CLK
1
Refresh Time
-
64
-
64
-
64
-
64
-
64
-
64
-
64
-
64
ms
Note : 1. A new command can be given tRRC after self refresh exit
Rev. 1.9/Apr.01
8
HY57V651620B
DEVICE OPERATING OPTION TABLE
HY57V651620B(L)TC-55
C A S Latency 183MHz(6ns) 166MHz(7ns) 143MHz(7ns) 3CLKs 3CLKs 3CLKs tRCD 3CLKs 3CLKs 3CLKs tRAS 7CLKs 7CLKs 7CLKs tRC 10CLKs 10CLKs 10CLKs tRP 3CLKs 3CLKs 3CLKs tAC 5.4ns 5.4ns 5.4ns tOH 2.7ns 2.7ns 2.7ns
HY57V651620B(L)TC-6
C A S Latency 166MHz(6ns) 143MHz(7ns) 133MHz(7.5ns) 3CLKs 3CLKs 3CLKs tRCD 3CLKs 3CLKs 3CLKs tRAS 7CLKs 7CLKs 6CLKs tRC 10CLKs 10CLKs 9CLKs tRP 3CLKs 3CLKs 3CLKs tAC 5.4ns 5.4ns 5.4ns tOH 2.7ns 2.7ns 2.7ns
HY57V651620B(L)TC-7
C A S Latency 143MHz(7ns) 133MHz(7.5ns) 125MHz(8ns) 3CLKs 3CLKs 3CLKs tRCD 3CLKs 3CLKs 3CLKs tRAS 7CLKs 6CLKs 6CLKs tRC 10CLKs 9CLKs 9CLKs tRP 3CLKs 3CLKs 2CLKs tAC 5.4ns 5.4ns 6ns tOH 2.7ns 2.7ns 3ns
HY57V651620B(L)TC-75
C A S Latency 133MHz(7.5ns) 125MHz(8ns) 100MHz(10ns) 3CLKs 3CLKs 2CLKs tRCD 3CLKs 3CLKs 2CLKs tRAS 6CLKs 6CLKs 5CLKs tRC 9CLKs 9CLKs 7CLKs tRP 3CLKs 3CLKs 2CLKs tAC 5.4ns 6ns 6ns tOH 2.7ns 3ns 3ns
HY57V651620B(L)TC-8
C A S Latency 125MHz(8ns) 100MHz(10ns) 83MHz(12ns) 3CLKs 2CLKs 3CLKs tRCD 3CLKs 2CLKs 3CLKs tRAS 7CLKs 5CLKs 6CLKs tRC 10CLKs 7CLKs 9CLKs tRP 3CLKs 3CLKs 2CLKs tAC 6ns 6ns 6ns tOH 3ns 3ns 3ns
HY57V651620B(L)TC-10P
C A S Latency 100MHz(10ns) 83MHz(12ns) 66MHz(15ns) 2CLKs 2CLKs 2CLKs tRCD 2CLKs 2CLKs 2CLKs tRAS 5CLKs 5CLKs 4CLKs tRC 7CLKs 7CLKs 6CLKs tRP 2CLKs 2CLKs 2CLKs tAC 6ns 6ns 6ns tOH 3ns 3ns 3ns
Rev. 1.9/Apr.01
9
HY57V651620B(L)TC-10S
CAS Latency 100MHz(10ns) 83MHz(12ns) 66MHz(15ns) 3CLKs 2CLKs 2CLKs
tRCD 3CLKs 2CLKs 2CLKs
tRAS 5CLKs 5CLKs 4CLKs
tRC 8CLKs 7CLKs 6CLKs
tRP 3CLKs 2CLKs 2CLKs
tAC 6ns 6ns 6ns
tOH 3ns 3ns 3ns
57V651620B(L)TC-10
CAS Latency 100MHz(10ns) 83MHz(12ns) 66MHz(15ns) 3CLKs 2CLKs 2CLKs
tRCD 3CLKs 2CLKs 2CLKs
tRAS 5CLKs 5CLKs 4CLKs
tRC 8CLKs 7CLKs 6CLKs
tRP 3CLKs 2CLKs 2CLKs
tAC 8ns 6ns 6ns
tOH 3ns 3ns 3ns
HY57V651620B
COMMAND TRUTH TABLE
A10/ AP OP code
Command
CKEn-1
CKEn
CS
RAS
CAS
WE
DQM
ADDR
BA
Note
Mode Register Set
H
X
L H
L X H L
L X H H
L X
X
No Operation
H
X L H H
X
X
Bank Active Read
H
X
L
X
RA L
V
H Read with Autoprecharge Write H Write with Autoprecharge Precharge All Banks H Precharge selected Bank Burst Stop DQM Auto Refresh Entry Self Refresh1 Exit L H H H H
X
L
H
L
H
X
CA H L
V
X
L
H
L
L
X
CA H H
V
X V
X
L
L
H
L
X
X L
X
L
H X
H
L
X V
X X X
H L
L L H
L L X H X H X H X V X
L L X H X H X H X V
H H X
X X
X X
H L H H X
Entry Precharge power down Exit
H
L L H H
X X X X L H H X X L V X X
L
H
Clock Suspend
Entry
H
L
Exit
L
H
Note : 1. Exiting Self Refresh occurs by asynchronously bringing CKE from low to high 2 . X = D o n t c a r e , H = L o g i c H i g h , L = L o g i c L o w . B A = B a n k A d d r e s s , R A = R o w A d d r e s s , C A = C o l u m n A d d r e s s , Opcode = Operand Code, NOP = No Operation
Rev. 1.9/Apr.01
11
HY57V651620B
PACKAGE INFORMATION
400mil 54pin Thin Small Outline Package
UNIT : mm(inch)
11.938(0.4700) 11.735(0.4620) 22.327(0.8790) 22.149(0.8720) 10.262(0.4040) 10.058(0.3960) 0.150(0.0059) 0.050(0.0020) 1.194(0.0470) 0.991(0.0390)
0.80(0.0315)BSC
0.400(0.016) 0.300(0.012)
5deg 0deg
0.597(0.0235) 0.406(0.0160)
0.210(0.0083) 0.120(0.0047)
Rev. 1.9/Apr.01
12


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